The influence of time and temperature were investigated in wafer exfoliation process by hydrogen implantation for 4H-SiC wafers with various orientations, on-axis and 8° off-axis (0001), (1100), and (1120). Void formation occurs isotropically for all the orientations investigated.

Transparency of SiC wafer: 65-70% transparency at 1064 nm for semi insulating SiC at 330 um thick, n type SiC is lower transparent rate, and different polytype between 6H and 4H also affect the transparency.

Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers.

Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS and Sensors.

Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive and need to be refurbished

What are Thin-Wafer-Handling Carriers? Thin-Wafer-Handling Carriers are tools that are used as Carriers in the manufacture of thin semiconductor wafers. Without the use of such Carriers, production and handling of very thin semiconductor wafers (down to approx. 50 microns) would be unthinkable. How do Thin-Wafer-Handling Carriers work? The device wafer is temporarily bonded to